For a Decade from the Release of the First Generation
From 2013 to 2023, Redmi and AAC Technologies completed their first decade of cooperation.
Throughout the decade, AAC Technologies has continued to support Redmi’s product competitiveness. AAC Technologies has been actively involved in almost every series and model released by Redmi. Together with Redmi, they have experienced rapid growth, overcoming numerous industry challenges and continuously releasing industry-leading products. AAC Technologies and Redmi have collaborated on innovative initiatives in areas such as haptics, acoustics, and optics, bringing consumers the benefits of technological advancement and creating better sensory experiences.
In preparation for the forthcoming decade, Redmi has forged an alliance with its Chinese supply chain partners, embarking upon the “CNY 2 Trillion New Ambition Project.” AAC Technologies, fueled by its relentless pursuit of technological innovation, is poised to ascend to lofty peaks, jointly propelling the evolution of the technology industry chain.
Kelvin Pan, Executive Vice President of AAC Technologies, asserts, “Throughout the past decade, Redmi has consistently proposed strict requirements and innovative product concepts, catalyzing our collective breakthroughs in the domains of technology, manufacturing, design, and supply chain management. In the new decade, we will team up with Redmi to bring the amazing technological advancements to people all around the world.”
During the Redmi 10th Anniversary and K70 Series Product Launch on the evening of November 29, Redmi unveiled three extraordinary products: K70, K70 Pro, and K70E. As the first flagships for Redmi’s new decade, they will comprehensively elevate the baseline of flagship performance and experience.
In terms of acoustics, the K70 series is equipped with SLS super linear speakers from AAC Technologies. The bottom-mounted and top-mounted SLSs of the K70 series, powered by AAC Technologies’ innovative super-linear technology, deliver astonishing output and rich high-fidelity sound quality. Together, they create a vast stereo soundstage, immersing users in an unparalleled life-like audio experience.
AAC Technologies Plays a Pivotal Role in Crafting an Exceptional Sensory Experience for This Ten-Year Masterpiece
The K70 series boasts an impressive haptic experience, thanks to AAC Technologies’ RichTap® integrated hardware and software solution. At its core, the K70 series features a high-performance X-axis linear actuator that delivers both high-quality and personalized haptics. Supported by the RichTap® solution, the K70 series not only offers a wide range of exceptional vibration effects within HyperOS but also seamlessly integrates into the industry’s leading ecosystems for superior vibration experiences. This ensures that users enjoy exceptional haptics across various software applications, including input methods, social media, gaming, and multimedia.
When it comes to sound pickup, the K70 series is equipped with AAC Technologies’ compact,high-performance analog microphone. It excels at capturing precise sound details even in noisy environments. Whether users are in bustling outdoor surroundings or engaged in activities such as making phone calls, recording audio, shooting videos, or making voice commands, the K70 series ensures a clear and stable voice experience.
In terms of heat dissipation, the entire K70 series has undergone remarkable advancements. Both K70 and K70 Pro feature the innovative loop heat pipe that ensures sustained cooling and strong performance. This cooling technology was developed by Redmi with research and development assistance, as well as implementation support from AAC Technologies. It incorporates a one-way circulation structure to significantly accelerate the transmission of coolant. It also utilizes independent channels for vapor and liquid, enabling efficient heat dissipation. Through testing, loop heat pipe demonstrates a 300% improvement in heat dissipation capacity compared to traditional vapor chambers (VCs). Moreover, it is lightweight and slim, providing better stacking with other components in devices.
K70E features an upgraded super-large 5,000mm² eSports-grade stainless steel VC, tailor-made by AAC Technologies. Compared to its predecessor, the thermal conductivity surface area is increased by up to 26.6%, further enhancing the robust performance of K70E.