瑞声科技宣布拟收购Premium Sound Solution（PSS）
瑞声科技（AAC Technologies）和Premium Sound Solutions欣然宣布，根据双方订立的合作协议，瑞声科技拟收购Premium Sound Solutions的多数股权。
瑞声科技宣布拟收购Premium Sound Solution（PSS） Read More »
Super Compact and Super High: AAC Launches MEMS Speaker – SOPRANO
In order to further lead the development of smart wearables and promote TWS earphones, smart glasses, hearing aids and other products to achieve high performance and thinness, AAC has recently launched SOPRANO, an ultra-small MEMS speaker tweeter unit, with a package size of only 16.2 mm³. This innovative landmark product may be the smallest MEMS speaker unit in the industry at present.
Super Compact and Super High: AAC Launches MEMS Speaker – SOPRANO Read More »
极致轻薄，绝佳高音 | 瑞声科技MEMS扬声器新品SOPRANO发布
近日瑞声科技推出了一款里程碑式的创新产品——超小型MEMS扬声器高音单元SOPRANO，封装尺寸仅16.2mm³，可能是目前业界体积最小的MEMS扬声器单元。
极致轻薄，绝佳高音 | 瑞声科技MEMS扬声器新品SOPRANO发布 Read More »
The Lightest and Thinnest Galaxy Z Fold Is Coming!
Samsung’s Galaxy Z Fold5, the 5th-gen foldable flagship, stole the spotlight as it was revealed on the evening of July 26. This phone is designed with a new drop hinge, with a weight of 253 g and a thickness of only 13.4 mm. The phone is unprecedentedly light and slim, bringing a whole new innovative experience.
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A 9.9 mm Foldable Smartphone! Honor Magic V2 Utilizes AAC’s Ultra Slim Sensory System Solution
Progressing towards evolution, a remarkable transformation. Honor’s Magic V2, the highly-anticipated foldable flagship, stole the spotlight as it was revealed on the evening of July 12.
“毫米级”折叠屏！荣耀Magic V2搭载瑞声科技“超轻薄”感知系统解决方案
作为荣耀的合作伙伴，瑞声科技与荣耀技术共创，联合为Magic V2定制了“超轻薄”的感知系统解决方案。在备受关注的铰链技术方面，瑞声科技执行副总裁潘开泰表示，Magic V2通过全新铰材料的应用、创新工艺的使用、内部结构的革新，带来目前业内坚固可靠的折叠屏体验。
“毫米级”折叠屏！荣耀Magic V2搭载瑞声科技“超轻薄”感知系统解决方案 Read More »
AAC’s First In-House Haptic IC Hits the Market, a Full-Stack Solution Integrating Hardware, Software, and Chips
AAC has recently launched the RT6010,AAC’s First In-house Chip. We have also commercialized this chip in mass production with a world-leading panoramic imaging brand.
瑞声科技发布首款自研Haptic IC，打造“硬件+算法+芯片”全链路解决方案
瑞声科技发布首款自主研发的马达驱动芯片RT6010，并携手全球领先的全景影像品牌，顺利实现了量产商用。
瑞声科技发布首款自研Haptic IC，打造“硬件+算法+芯片”全链路解决方案 Read More »
精彩回顾！一起“云逛”瑞声科技 2023 MWC现场 →
瑞声科技携声学、光学、触感、传感器及半导体、精密制造、XR和车载七大业务产品集体亮相，更带来多款首次亮相的创新技术，向全球行业客户和用户全面展现了AAC感知体验解决方案的领先技术和服务实力。
精彩回顾！一起“云逛”瑞声科技 2023 MWC现场 → Read More »