September 23 — AAC Technologies and Intel have entered into a liquid cooling ecosystem partnership. The two companies held a signing ceremony at the 2026 Intel Technology Innovation and Industry Ecosystem Conference at the Suzhou International Expo Center. Richard Mok, Executive Director of AAC Technologies Group, and Peter Chen, Vice President of Intel’s Data Center Group and General Manager of Intel China, signed the cooperation agreement on behalf of both parties.
(Richard Mok, Executive Director of AAC Technologies Group, and Peter Chen, Vice President of Intel’s Data Center Group and General Manager of Intel China, sign the cooperation agreement.)
The signing marks AAC Technologies’ official entry into the Intel China Data Center Liquid Cooling Innovation Acceleration Program. The two parties will collaborate deeply in data center liquid cooling technology R&D, product innovation, solution validation, and industry ecosystem development, jointly advancing green, efficient, and reliable data center infrastructure for the AI era.
With the rapid growth of artificial intelligence, high-performance computing, cloud services, and large-model applications, data center compute density continues to rise. Under higher power consumption, greater heat flux, and more complex system deployment conditions, traditional cooling methods are facing mounting challenges. With higher thermal management efficiency and better energy efficiency, liquid cooling is moving from frontier exploration to large-scale deployment, becoming a key technology direction underpinning next-generation AI infrastructure.
Leveraging 30 years of deep accumulation in technology, AAC Technologies has built system-level capabilities validated at scale in the market, with strong expertise in microstructure processing, thermal management, vapor chamber (VC) heat dissipation, cold plate manufacturing, automated production, and large-scale delivery. In recent years, the company has accelerated its presence in data center liquid cooling, AI server thermal management, and high-end thermal management. It continues to invest in cold plates, UQD/QD quick connectors, manifolds, VC-enhanced heat dissipation, CDUs, system-level liquid cooling solutions, and validation capabilities, building globally leading system-level thermal management capability.
(Group photo of the project teams from AAC Technologies and Intel)
Under this collaboration, the two companies plan to combine Intel’s experience in data center platforms, server architecture, liquid cooling reference designs, ecosystem validation, and industry collaboration with AAC Technologies’ strengths in precision manufacturing, thermal product development, engineering implementation, and large-scale production. Together, they will advance liquid cooling technology for high-density servers and rack-level architectures. The collaboration will focus on core liquid cooling components, system-level solutions, and validation capabilities, spanning CPU cold plates, memory and SSD liquid cooling, UQD/QD quick connectors, manifolds, CDUs, as well as node-level and rack-level liquid cooling solutions for complete systems.
In the future, the two parties will continue to advance technical exchanges, joint validation, capability building, and ecosystem collaboration around cooperative projects. On the basis of open collaboration, they will explore more innovation opportunities for AI data centers and high-performance computing scenarios. AAC Technologies looks forward to growing together with Intel, enhancing capabilities across the liquid cooling industry chain, and working with more ecosystem partners to build a greener, more efficient, and more open next-generation data center infrastructure ecosystem.