Recently, AAC Technologies announced that its CoolFan series of active cooling chips, powered by core MEMS piezoelectric thin film technology, has completed R&D and entered the small-batch trial production phase, with mass production and shipment expected in early 2027. The chips are designed for a wide range of applications, including AI smartphones, smartwatches, XR glasses, and various other AI terminal devices.
As edge AI models rapidly proliferate, the power consumption of consumer electronics chips continues to rise, and the resulting heat accumulation significantly bottlenecks performance. This has created an increasingly urgent industry demand for miniaturized, low-noise, and low-power active cooling solutions. Featuring chip-scale design and packaging with Surface Mount Technology (SMT) support, MEMS piezoelectric fans enable flexible integration within devices. By delivering high-velocity, directional airflow to pinpoint core heat sources like chips, they provide highly efficient active cooling, unleashing the full potential of edge AI computing power and enhancing the user experience.
Leveraging nearly two decades of expertise in MEMS design and manufacturing, AAC Technologies has integrated advanced research in piezoelectric thin film materials, actuator chip structural simulation, wafer-level manufacturing process optimization, and customized packaging. This synergy allows the MEMS piezoelectric cooling solutions to deliver superior performance across four core metrics—airflow, back pressure, noise, and power consumption—addressing the application needs of terminal devices.
At just 1 mm thick, the product is over 50% thinner than conventional piezoelectric ceramic fans or miniature centrifugal fans. Utilizing functional piezoelectric thin film materials, the product achieves an industry-leading airflow of over 3 L/min at low driving voltages, with power consumption kept below 100 mW. Combined with optimized jet structure design and process refinement, it maintains a back pressure exceeding 500 Pa while effectively suppressing noise to 30 dB.
(Schematic Diagram of Cooling Mechanism)
AAC Technologies is currently collaborating with industry-leading customers to co-define specifications for MEMS piezoelectric fan products. The product has received positive performance feedback from several customers and is undergoing end-device validation. Products for key customer projects are expected to hit the market in the first half of 2027. Additionally, the company is working with emerging AI hardware manufacturers to explore applications in XR, robotic dexterous hands, and other scenarios.
The successful development of MEMS active cooling chip technology further enhances AAC Technologies’ AI thermal management portfolio. Looking ahead, AAC Technologies will continue to deepen its presence in AI devices, smart vehicles, robotics, and server liquid cooling. By leveraging advanced thermal management technologies, the company aims to help smart devices reach higher performance levels and provide core support for industry advancement.